[Scrap] Optimising BGA signal routing in PCB designs
Optimising BGA signal routing in PCB designs Posted:02 Feb 2015 Ball grid array ( BGA ) device packaging is today's standard for housing a range of highly advanced and complex semiconductor devices such as FPGAs and microprocessors. The technology of BGA packaging for embedded designs is steadily advancing to keep up with chipmaker technical advances, with this type of packaging splintering out into standard and micro BGAs. Today, both types deal with increasing numbers of I/Os, and this means signal escape routing is difficult and challenging, even for experienced printed circuit board (PCB) and embedded designers. The top job for the embedded designer is to develop appropriate fan-out strategies that won't adversely affect board fabrication. There are several major considerations involved in selecting the correct fan-out/routing strategy: ball pitch, land diameter, number of I/O pins, via types, pad size, trace width and spacing, and the number of layers required t